Issue B.2 07/08
Page 12 of 14
OPTEK reserves the right to make changes at any time in order to improve design and to supply the best product possible.
OPTEK Technology Inc. — 1645 Wallace Drive, Carrollton, Texas 75006
Phone: (972) 323-2200 or (800) 341-4747 FAX: (972) 323-2396 visibleLED@optekinc.com www.optekinc.com
Lednium Series Optimal X
OVTL09LG3x Series
Typical elements in the conducting path and corresponding nominal thermal conductivities are:
Elements w/mK
Epilayers GaN/InGaN 150
Substrate Sapphire 50
Die attach material Conductive epoxy 10
Package Silver plated copper 350
Solder Solder (Sn/Ag/Cu) 35
Copper cladding Copper 300
Note : Thermal conductivity is a physical constant. For the materials above, the respective contribution each makes
to the overall thermal resistance (Rθ
j-b) is a function of the thickness of each material layer, and the surface area.
Thermal Conductivity (TC) is defined to be the heat conducted in time (t), through thickness (T) in a direction normal
to a surface area (A), due to a temperature difference (δT).
Therefore TC= q/t x {T/[A x
δT]}
and
δT = [Q x T]/[A x TC] where
δ
T = Temp. difference (K)
Q = Power (w)
A = Surface area (m
2)
T = layer thickness (m)
TC = Thermal Conductivity (w/mK)
Theoretical Calculation (for 1 watt dissipated in a cup product via a single 40mil die)
GaN Thickness approx 10 x 10-6
= 1 x 10x10
-6/ 10-6
x 150
Area 10
-6
= 0.07 K
Substrate T = 60 x 10-6
= 1 x 60x10
-6/ 10-6
x 50
= 1.2 K
Die attach T = 20 x 10-6
= 1 x 20x10
-6
/ 2x10
-6
x 10
A = 2 x 10
-6
= 1
Package T = 0.4x10-3
= 1 x 0.4x10
-3/ 6x10-6
x 350
A = 6x10
-6
= 0.19
Solder T = 60x10-6
= 1 x 60x10
-6/6x10-6
x 25
A = 6x10
-6
= 0.4
Total Calculated
δT = 2.86K
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相关代理商/技术参数
OVTL09LG3WW 功能描述:大功率LED - 白色 Warm White 3200K 230lm 1050mA RoHS:否 制造商:Cree, Inc. 照明颜色:Cool White 颜色温度:5000 K 光通量:280 lm 显示角:125 deg 正向电流:700 mA 正向电压:2.9 V 安装风格:SMD/SMT 系列:XMLBWW 封装:Reel
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